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![PDF] THERMAL CYCLING RELIABILITY AND FAILURE MODE OF TWO BALL GRID ARRAY PACKAGES WITH HIGH RELIABILITY Pb- FREE SOLDER ALLOYS | Semantic Scholar](https://d3i71xaburhd42.cloudfront.net/ac48ebe0d1eba96f2fea1fd96ed7d2313c505843/4-Table3-1.png "PDF] THERMAL CYCLING RELIABILITY AND FAILURE MODE OF TWO BALL GRID ARRAY PACKAGES WITH HIGH RELIABILITY Pb- FREE SOLDER ALLOYS | Semantic Scholar")
PDF] THERMAL CYCLING RELIABILITY AND FAILURE MODE OF TWO BALL GRID ARRAY PACKAGES WITH HIGH RELIABILITY Pb- FREE SOLDER ALLOYS | Semantic Scholar
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